Overview
The Atten ST-862D Hot Air Soldering Rework Station is a versatile tool used for soldering and desoldering electronic components. It provides a controlled stream of hot air to remove and reflow surface mount components on PCBs.
Risks
- Burn Risk: Hot air nozzle can reach high temperatures.
- Overheating: Continuous use at high temperatures may cause the station to overheat.
- Component Damage: Improper use of hot air can damage sensitive electronic components.
- Hazardous Fumes: Melting solder produces fumes that shoul
Safety Precautions
- Keep the work area well-ventilated to prevent inhaling solder fumes.
- Turn off hot air rework station when not in use.
- Avoid touching nozzle and heated components during operation and cool down, or use heat-resistant gloves.
Glossary
- Hot Air Nozzle: The attachment that emits hot air for soldering and desoldering. The nozzle is changeable depending on desired focus of hot air.
- PCB: Printed Circuit Board, the board on which electronic components are mounted.
- Reflow: The process of melting and re-solidifying solder to join or remove components.
Procedures
Soldering with Hot Air
- Attach the appropriate hot air nozzle to the handle.
- Power on the Atten ST-862D and set the desired temperature using the control panel.
- Place the PCB on a heat-resistant surface and secure it if necessary.
- Apply flux to the solder pads and components to be soldered.
- Hold the hot air nozzle about 2-3 cm above the solder joints and apply hot air in a circular motion until the solder melts and flows smoothly.
- Remove the hot air and wait for the solder to solidify.
- Inspect the solder joints for any defects and rework if necessary.
Desoldering with Hot Air
- Attach the appropriate hot air nozzle to the handle.
- Power on the Atten ST-862D and set the desired temperature using the control panel.
- Apply flux to the solder joints you want to desolder.
- Hold the hot air nozzle about 2-3 cm above the solder joints and apply hot air until the solder melts.
- Use tweezers or a desoldering tool to lift the component gently once the solder has melted.
- Clean the pads and the component with a desoldering wick or vacuum to remove any remaining solder.